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Showing posts from April, 2020

Surging Need for Enterprise Agility augments the Global Could Collaboration Market Growth at 14.21%

According to a new market research report published by Inkwood Research, the Global Could Collaboration Market is projected to register a CAGR of 14.21% in terms of revenue during the forecasting years of 2019-2028. "Browse 47 Market Data Tables and 48 Figures spread over 173 Pages, along with an in-depth TOC on the Global Could Collaboration Market Forecast 2019-2028.” REQUEST FREE SAMPLE LINK - https://www.inkwoodresearch.com/reports/cloud-collaboration-market/#request-free-sample The business requirements are changing, and the companies are looking for services that will offer easy access, along with an increase in productivity. Also, with the growing automation trends and evolving mobility, it becomes important for industries to seek out solutions that offer services at reduced infrastructure costs. Cloud collaboration aids in achieving high productivity and access to real-time data. The employees across several organizations are using cloud-based collaboration

Global Laser Direct Structure Antenna Market to Record Significant Growth at 20.06%

According to a new market research report published by Inkwood Research, Global Laser Direct Structure Antenna Market is predicted to register a CAGR of 20.06% during the forecasting years of 2020-2028. "Browse 23 Market Data Tables and 35 Figures spread over 123 Pages, along with an in-depth TOC on the Global Laser Direct Structure Antenna Market Forecast 2020-2028.” REQUEST FREE SAMPLE LINK - https://www.inkwoodresearch.com/reports/laser-direct-structure-antenna-market/#request-free-sample The Laser Direct Structuring (LDS) technology is one of the fastest-growing segments of the molded interconnect devices (MID) market. The LDS market is gaining popularity with the wave of miniaturization becoming prominent across various industries, which allows integration of smaller designs with various components. The age of modern electronics has presented manufacturers with many challenges, such as miniaturization, compact electronic packaging, and increased performance deman